Thermal Drawing Device Update Pt. 2

We made several more modifications to the thermal drawing device.

After setting the PID temperature >150 degrees Celsius, we noticed that the 3D printed PLA preform holder was softening and warping as it got close to the heating block. To accommodate this, the preform holder and spool were printed with a high temperature resin to ensure they would stay intact during the drawing process. 

 

The final version of the spool and preform holder, with printing supports still attached

Another major modification made was the addition of side panels to improve heat insulation. Acrylic panels were laser cut and fitted to two sides and the top of the device. Panels were not added to all sides so that the interior of the device could be easily accessed to adjust the preform.

 

Acrylic, laser cut panels attached to device to improve heat insulation during drawing

Since heat loss was found to be a large issue during drawing attempts, additional insulation was provided with cardboard and aluminum siding. These piece were temporarily fixed to the device with tape so they could be moved when the preform needed to be manually positioned. With more time, acrylic panels could be added to all sides with a door on hinges on one side.

 

Final thermal drawing device, with cardboard and aluminum foil siding